📞 +91-11-43538922/ +91-9540478806 | 📩 info@neobyte.net.in
📞 +91-11-43538922/ +91-9540478806 | 📩 info@neobyte.net.in
Thermal Simulation is a model of the heat transfer between heat sources that includes energy equations and calculations used to describe heat conduction, heat and fluid convection, and latent heat exchanges
Thermal aspects of any design, often gets its attention when it has already dissipated the heat in the designer’s mind. It leads to patch-up arrangement resulting in non-optimal design. We help the designers in the early stages of the design, identify potential issues, hot spots, Thermal gradients, creep analysis, dissipation management effectiveness i.e. complete simulation engineering including detailed temperatures and heat flow paths.
Our qualified team of Engineers suitably equipped with rich experience in Thermal Analysis and necessary software tools is keen to manage the heat flow in your design. With the flow simulation techniques – we manage the Heat Path, Coolant medium flow and effectiveness of the same.
We solve these types of problems for clients across the aerospace, defense and industrial, through finite element analysis or CFD analysis, depending on the application and required results—and provide recommendations for redesign.
Quickly perform complete component thermal analysis on designs incorporating printed circuit boards (PCBs) and electronics with easy-to-use SOLIDWORKS Flow Simulation and the Electronic Cooling Module. Analyze heat transfer by conduction, convection, and radiation with the Heat Transfer Module, which includes a comprehensive set of features for investigating thermal designs and effects of heat loads. You can model the temperature fields and heat fluxes throughout devices, components.
Easily investigate the impact of cooling and design changes on component temperatures using thermal analysis in SOLIDWORKS Flow Simulation. You can quickly determine the impact in and around the design to ensure correct thermal performance, product quality, and safety.
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